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Minimum order for IC7 is 50pcs, minimum for IC24 is 25pcs to qualify for distributor pricing (subject to change).
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Innovation Cooling Diamond Extreme Performance Thermal Compound
IC Logo Click here for real world user reviews from top tech sites!
Manufacturer Website:
www.innovationcooling.com
  IC7 (1.5g - contains 7 carats micronized diamond by weight)     IC24 (5g - contains 24 carats micronized diamond by weight)  
IC7 IC24
 
Compound Description and Data
 

IC Diamond 7 or 24 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond's superior thermal conductivity.


Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver.
Diamond's five times better thermal conductivity compared to silver makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive.

 
Key Features
 
  • Each tube of IC Diamond Thermal grease contains 7 or 24 carats of micronized diamond with diamond particle loadings @ 94% by weight. Material loading above 90% is recommended as the best combination of rheological and thermal properties to minimize interface pump out due to thermal cycling.
  • Superior bulk conductivity
  • Excellent thermal impedance
  • Tight particle distributions
  • < 40 µ maximum particle diameter
  • Silicone free
  • Lower viscosity
  • Greater stability
  • Non capacitive or electrically conductive

Curing Time: IC Diamond requires minimal time to attain peak performance; in most cases, IC Diamond will reach peak performance after two hours of use *
Stability: IC Diamond is designed for stability - it will not bleed or separate in normal use.
 
Key Specifications
 

Thermal Conductance: 4.5 W/m-K (data acquired with an ASTM D - 5470 thermal interface test instrument)
Thermal Resistance: 0.25oC-cm2/W@ 100 µ BLT
Average Particle Size: <40 µ maximum particle diameter
Compliancy: RoHS Compliant.


Note* Cure Time Assumes an optimized pressure of 50  PSI. Lighter load pressures will increase cure times to a week or more.
 
The IC Diamond Advantage
 
Most other thermal compounds are very thin because they are lightly loaded. This can cause PUMP OUT/BAKE OUT from thermal load over time. PUMP OUT/BAKE OUT IS A WELL DOCUMENTED AND OBSERVED REASON FOR THERMAL COMPOUND FAILURE! IC Diamond contains either 7 or 24 carats (by weight depending on size of tube) of micronized diamond particles which means never having to worry about it sneeking out and away from where it needs to stay...protecting the CPU or GPU. Plus, other thermal compounds require many hundreds of hours of thermal cycling to “break in.” IC Diamond just needs 2 hours typically, but even under less than ideal conditions it will set up usually within a week on average.
IC Diamond was specifically formulated and intensely tested to overcome the common limitations of the “common” thermal compounds. Because most other compounds are lightly loaded and very thin, they can break down much sooner causing the machine to perform poorly, shorten it’s lifespan, or even cause system failure. Just look at the image below for a spread/compression comparison of IC Diamond and other top thermal compounds.
Compression Test
 
Reviews From the Web
 
IC Diamond has been extensively tested not only in the lab, but from real world users. From hardcore overclockers, to system and server builders. Through real-world testing, IC Diamond has proven itself to be a superiour and reliable product. The added benefit of IC Diamond is that it is readily available and cost effective, unlike other thermal compounds that deliver great performance but are more exotic and thus hard to find and very expensive. Please click on the link below to see real-world results obtained from independant users from a wide cross section of people.

 

IC Diamond Web Reviews
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